Amplify Your Career in Design for Testability

Master the critical skills of Scan, ATPG, and BIST. Learn from industry experts to ensure chip quality and become a highly sought-after DFT engineer.
Get 100% placement support to land your dream job at a top-tier company

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Design For Testability Overview

Design for Testability (DFT) is the engineering practice of inserting special test logic into a chip’s design. Why? Because after a chip is manufactured, it’s impossible to check every one of its billion transistors.

A DFT engineer’s job is to ensure that every manufactured chip can be efficiently tested for physical defects (like “stuck” wires or shorts). This process is critical for quality, reliability, and cost-effective high-volume manufacturing. At Tri-Amp, we train you to become a specialist in this high-demand, high-impact domain.

Duration

24 Weeks / 6 Months

TRAINING MODES

Full-Time Offline (Classroom) & Live Online

DESIGNED FOR

B.Tech/M.Tech Graduates & Working Professionals in VLSI

  • Flexible Learning: Choose between immersive Offline (Classroom) training at our state-of-the-art lab or interactive Live Online classes.
  • Hands-On Labs: The course is 70% practical. You will have 24/7 remote access to our servers to work on projects using licensed EDA tools.
  • Dedicated Support: Get your doubts cleared instantly through dedicated support channels and scheduled 1-on-1 mentorship sessions with your trainers.
  • Total Duration: 24 Weeks (6 Months)
  • Class Schedule:
    Offline/Online: 5 days a week (Mon-Fri)
    Daily Sessions: 3 hours of expert-led theory + 4 hours of dedicated, mentored lab sessions.
  • Total Hours: 400+ hours of intensive, hands-on learning.

  • DFT Tools: Siemens Tessent, Synopsys TestMAX, Cadence Modus

  • Simulation: (For verifying DFT logic) Siemens Questa, Synopsys VCS

  • Scripting: TCL (for tool automation)

  • Lab Access: 24/7 remote VPN access to our high-performance servers, ensuring you work on licensed, full-version tools for scan insertion, compression, ATPG, and BIST.

  • Fresh Graduates: B.E/B.Tech/M.E/M.Tech in ECE, EEE, or allied fields (e.g., 2023/2024/2025 pass-outs).

  • Working Professionals: Engineers in testing, validation, or other domains looking to transition into a core VLSI career.

  • Faculty: College lecturers seeking to upgrade their skills with current industry practices.

  • Prerequisites: Strong fundamentals in Digital Logic Design. Basic knowledge of Verilog is highly recommended.

  • Flexible Payments: Pay the course fee through secure online banking, credit/debit cards, or UPI.

  • EMI Options: We offer no-cost EMI options through our financial partners. Talk to our admissions counselor to find a payment plan that works for you.

  • Our Commitment: Our dedicated placement team provides 100% placement support as a core part of the program.

  • Career Prep: We conduct rigorous mock interviews, technical presentation sessions, and resume-building workshops.

  • Hiring Partner Network: We have direct connections with top-tier semiconductor companies and will actively schedule your interviews for open positions.

Tri-Amp’s Design For Testability Curriculum

1: Essentials of Linux
  • Introduction to Linux,
  • Command Line Operators,
  • File Operations, Processes,
  • Text Editors,
  • Text Manipulating,
  • Network Operations,
  • Special Keystrokes
  • GVIM
2: Digital Design
  • Number System, Boolean Algebra,
  • SOP and POS, K-Map,
  • Combinational circuits, Sequential circuits,
  • Finite State machines,
  • Frequency Division,
  • Setup and Hold time checks,
  • Advance Design Issues: Metastability, Noise Margins Power,
  • Fanout, Timing Considerations, FIFO Depth Calculation
3: CMOS Devices and Technology
  • Electronic Devices, Power Sources, Thevenin and Norton Theorem
  • Semiconductors Device Physics : Atomic Structure, Electronic Configuration, Doping, Diode – Biasing and VI Characteristics
  • MOSFET : Regions of operation, VI Characteristics
  • Function implementation using CMOS
  • Stick Diagram and Layout
  • Second order effects : Body Effect, Channel length modulation, Punch through, subthreshold conduction, DIBL
  • Process Technology : Clean Room, Wafer manufacturing, Oxidation, Diffusion, Ion Implementation, Lithography
4: Verilog HDL
  • Introduction to Verilog
  • Overview of Digital design with Verilog HDL
  • Hierarchical Modeling Concepts: Top-down, bottom-up Design Methodology, modules, components of simulation, stimulus block.
  • Modeling Styles in Verilog: Behavioral or algorithmic level, data flow level, gate level, switch level.
  • Basic concepts: Lexical conventions, Operators, data types, System tasks, directives, File Input and output.
  • Modules and Ports: Module definition, port declaration, connecting ports, hierarchical referencing.
  • Behavioral Modeling: Initial and always, blocking and non blocking statements, delay control, event control, conditional statements, loops, sequential and parallel blocks.
5: Introduction To DFT, DFT Basics
  • ASIC Flow
  • DFT Basics
  • Chip Fabrication Process
  • ATE Basics
6: Scan Insertion
  • Scan architecture overview
  • Scan Design Basics
  • Scan Golden Rules
  • Scan DRC Checks
  • Scan Insertion
  • Generate test protocol
7: Scan Compression
  • Basics/Need for Compression
  • Compression Techniques
  • On-Chip-Clocking
  • At-Speed Testing
8: Hierarchical Scan And Boundary Scan
  • Hierarchical Scan
  • Bscan (Boundary Scan)
  • JTAG
9: Introduction To ATPG,ATPG Basics
  • ATPG Basics
  • Faults Collapsing
  • ATPG Algorithms
10: Fault Models, Fault Classes
  • Fault Models
  • ATPG DRC
  • Fault Classes
  • ATPG Modes
11: Pattern Generation And Simulations
  • Simulation Basics
  • ATPG Simulations
  • Coverage Improvement
12 : At-Speed ATPG And Simulations
  • At-Speed ATPG
  • LOC and LOS
  • At-Speed Simulations
13: Simulations And Debugging
  • Scan Simulations Debug
  • Diagnosis Flow
  • Fault Simulation
14: BIST
  • BIST Architecture
  • Memory BIST
  • Logic BIST
Projects

A block-level design will be given as project, in which you need to analyze & fix various DRC violations and stitch the scan chain. Scan insertion needs to be performed with and without scan compression. In the next step ATPG patterns are generated for various fault models, and then simulate the patterns. Obtained test coverage needs to be improved further by using different test coverage improvement techniques.

1: Essentials of Linux
  • Introduction to Linux,
  • Command Line Operators,
  • File Operations, Processes,
  • Text Editors,
  • Text Manipulating,
  • Network Operations,
  • Special Keystrokes
  • GVIM
2: Digital Design
  • Number System, Boolean Algebra,
  • SOP and POS, K-Map,
  • Combinational circuits, Sequential circuits,
  • Finite State machines,
  • Frequency Division,
  • Setup and Hold time checks,
  • Advance Design Issues: Metastability, Noise Margins Power,
  • Fanout, Timing Considerations, FIFO Depth Calculation
3: CMOS Devices and Technology
  • Electronic Devices, Power Sources, Thevenin and Norton Theorem
  • Semiconductors Device Physics : Atomic Structure, Electronic Configuration, Doping, Diode – Biasing and VI Characteristics
  • MOSFET : Regions of operation, VI Characteristics
  • Function implementation using CMOS
  • Stick Diagram and Layout
  • Second order effects : Body Effect, Channel length modulation, Punch through, subthreshold conduction, DIBL
  • Process Technology : Clean Room, Wafer manufacturing, Oxidation, Diffusion, Ion Implementation, Lithography
4: Verilog HDL
  • Introduction to Verilog
  • Overview of Digital design with Verilog HDL
  • Hierarchical Modeling Concepts: Top-down, bottom-up Design Methodology, modules, components of simulation, stimulus block.
  • Modeling Styles in Verilog: Behavioral or algorithmic level, data flow level, gate level, switch level.
  • Basic concepts: Lexical conventions, Operators, data types, System tasks, directives, File Input and output.
  • Modules and Ports: Module definition, port declaration, connecting ports, hierarchical referencing.
  • Behavioral Modeling: Initial and always, blocking and non blocking statements, delay control, event control, conditional statements, loops, sequential and parallel blocks.
5: Introduction To DFT, DFT Basics
  • ASIC Flow
  • DFT Basics
  • Chip Fabrication Process
  • ATE Basics
6: Scan Insertion
  • Scan architecture overview
  • Scan Design Basics
  • Scan Golden Rules
  • Scan DRC Checks
  • Scan Insertion
  • Generate test protocol
7: Scan Compression
  • Basics/Need for Compression
  • Compression Techniques
  • On-Chip-Clocking
  • At-Speed Testing
8: Hierarchical Scan And Boundary Scan
  • Hierarchical Scan
  • Bscan (Boundary Scan)
  • JTAG
9: Introduction To ATPG,ATPG Basics
  • ATPG Basics
  • Faults Collapsing
  • ATPG Algorithms
10: Fault Models, Fault Classes
  • Fault Models
  • ATPG DRC
  • Fault Classes
  • ATPG Modes
11: Pattern Generation And Simulations
  • Simulation Basics
  • ATPG Simulations
  • Coverage Improvement
12 : At-Speed ATPG And Simulations
  • At-Speed ATPG
  • LOC and LOS
  • At-Speed Simulations
13: Simulations And Debugging
  • Scan Simulations Debug
  • Diagnosis Flow
  • Fault Simulation
14: BIST
  • BIST Architecture
  • Memory BIST
  • Logic BIST
Projects

A block-level design will be given as project, in which you need to analyze & fix various DRC violations and stitch the scan chain. Scan insertion needs to be performed with and without scan compression. In the next step ATPG patterns are generated for various fault models, and then simulate the patterns. Obtained test coverage needs to be improved further by using different test coverage improvement techniques.

What Makes Tri-Amp Stand Out

We’re committed to providing an unparalleled learning and career experience.

Flexible Learning Modes

Choose the learning environment that suits you best. We offer comprehensive full-time courses with both offline (classroom) and live online modes.

Expert Trainers & 1-on-1 Mentorship

Learn directly from industry architects with 20+ years of experience, who provide 1-on-1 mentorship, personalized feedback, and direct career guidance.

Real-World Internship Programs

Bridge the gap between theory and practice with our short-term and long-term internship programs, giving you invaluable industry exposure on real projects.

Job-Ready Interactive Sessions

Master the skills employers want. We conduct rigorous mock interviews and technical presentations to sharpen your domain expertise and placement readiness.

Full Access to Licensed EDA Tools

Gain practical proficiency using licensed, industry-standard EDA tools from Cadence, Synopsys, and Siemens. You will work on the real thing, not simulations.

100% Placement Support

Your success is our mission. We provide 100% placement support, from resume optimization to direct connections with our extensive network of hiring partners.

Ready to Become a Chip Quality Expert?

You’ve seen the expert-led curriculum. The next step is to build your personal career path.

This form helps us understand your goals. When you tell us your qualification, your chosen domain, and your preferred learning mode, you’re not just signing up for a list.

You are enabling our expert industry counselors to:

  • Review Your Profile: We will personally review your background to confirm your eligibility and find the best fit.

  • Provide a Custom Roadmap: We’ll contact you to discuss the exact path from your current qualifications to a top-tier VLSI job.

  • Match You with an Expert: We’ll ensure you get to speak with the right person who understands your chosen domain.

This is a free, no-pressure career consultation with a VLSI professional. Let’s get started.

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